PathWave Advanced Design System (ADS) 2026 Update 1 Linux

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Free Download PathWave Advanced Design System (ADS) 2026 Update 1 Linux | 5.1 Gb
Keysight is releasing Advanced Design System (ADS) 2026 Update 1. This update includes features usability improvements for RFPro, SmartMount for 3D components, and ehanced Python support for Data Display.
Advanced Design System (ADS) 2026 introduces new capabilities for RF/MW, High-Speed Digital, Power, and Quantum Electronics applications, with powerful enhancements to 3DEM, layout verification, electro-thermal simulation, circuit simulation models, data and design management, and high-performance computing (HPC).
Owner:Keysight Technologies Inc.
Product Name:PathWave Advanced Design System (ADS)
Version:2026 Update 1
Supported Architectures:x64
Website Home Page :www.keysight.com
Languages Supported:english
System Requirements:Linux *
[b]Size:[/b]5.1 Gb


PathWave Advanced Design System (ADS) 2026 Update 1 Release Notes
ADS 2026 Update 1.0 features usability improvements for RFPro, SmartMount for 3D components, and ehanced Python support for Data Display.

Circuit Simulation
General
- Fixed Cgg and NFmin discrepancies between ADS and Spectre for bsimsoi v4.5.
- Starting with ADS 2026 Update 1.0, S-Parameter devices (SNPs) and linear components with arbitrary frequency-dependent behavior, such as transmission lines and User-Compiled Models (UCMs), now use an improved fitting algorithm and a more robust passivity enforcement method within Circuit Envelope simulations.
- ADS added support for the ctype parameter in Bsource. The ctype parameter denotes different implementations of a capacitor.
- When the value is:
. 1: bsource current is ddt(cap*V(node1, node2)), where cap is the bsource capacitor value with temp effect,
. mfactor effect, scale effect, and so on. V(node1, node2) is the voltage between the bsource terminals.
. 2: the current is ddt(cap).
. 0 or any other value: the current value is cap*ddt(V(node1, node2)).
- Default value is 0.
- Added support for L-UTSOI Version 102.80.
- Added support for reading multiple reference resistance values in the option line in Touchstone version 1 files. Please note that this is a non-standard extension to the Touchstone 1 file format.
- When either the simulator or data file tool writes Touchstone 1 files, port names are now included in the file in comments.
- Added ".convert_port" and ".portmapping" syntax to the supported HSPICE statements.
- Deprecation announcement: The SAW_Filter component is obsolete and will be removed in future releases.
Verilog-A
- The Verilog-A compiler (vamscomp) version is incremented to 3.0.1.
Data Display
Python API
- Data Display Python APIs official release. (See Data-Display within Python API )
- Add Export functionality for exporting Data Display windows into Python scripts. Use the Addon Manager to enable this functionality.
- Added ability to print Data Display pages as image files.
- Added support for adding new axes to a rectangular Description and additional properties to control labels and ticks.
- Added ability to add custom user axes.
- Added 'qwidget' property for windows to get the PySide object.
- Added additional marker functionality in Python API functionality.
General
- Add version control toolbar to Data-Display windows.
Design & Tech Management
General
- Version Control improvements:
. Added functionality to track custom files in version control.
. Added preference to automatically check out datasets before a simulation.
. Added version control status badge icons in Library and Folder views.
- Deprecation announcement: The "Delete Workspace" menu option is deprecated and will be removed in future releases.
Python API
- Added new addon and VS Code extension to quickly attach the debugger. (See Readme.md within HPEESOF_DIR\addons\python\debugpy_attach\)
- Added Python APIs for printing designs to PDF or image files.
- Added experimental notebook API to generate design reports with Python.
- Renamed "Copy Python Recipe Script" context menu option to "Export Python"
- Renamed the '.scripts' directory generated by the design environment Python Exporter to 'de_exported_scripts'.
Design Cloud
RF Microwave
- Parallel Simulation Support for Non-Sweep Analyses in Design Cloud. Design Cloud now supports parallel simulation when a schematic includes both non-sweep and sweep analyses. In this configuration:
. The subjob j0 executes the non-sweep analyses.
. The remaining subjobs handle the sweep analysis in parallel.
- Additionally, if a schematic contains only non-sweep analyses and the user requests parallel execution, Design Cloud will now support running those jobs in parallel as well. This feature is controlled via an environment flag. To enable, add ADS_SIM_MANAGER_ALLOW_NON_SWEEP_IN_PSM=1 in hpeesofsim.cfg or set ADS_SIM_MANAGER_ALLOW_NON_SWEEP_IN_PSM=1 in the .env file inside your design cloud installation directory.
Design Editing and Layout
General
- The plane dialog has been enhanced to remember the last used settings.
- Add an improved add-on to quickly attach debugpy to help debug Python scripts within the application.
- Fixed the issue where a slowdown would occur when browsing a layout after using Show Physical Connectivity on a large design.
Design Import/Export
- A warning message about retrying to read a file as drill file during drill file import is now printed to the import log instead of the Message List docking window.
- Following set of new AEL calls that allow for more control over non-interactive Gerber/drill import have been added:
. gbr_create_importer()
. gbr_import_set_overwrite()
. gbr_import_set_layermap_path()
. gbr_import_set_log_path()
. gbr_import_set_length_unit()
. gbr_import_set_zero_suppression_mode()
. gbr_import_set_num_integer_digits()
. gbr_import_set_num_fractional_digits()
. gbr_import_set_coordinate_mode()
. gbr_import_set_auto_merge()
. gbr_import_design()
Ground Plane
- Added Auto-Generate Planes feature to the layout. When enabled, ground planes will automatically update in the background after edits are made to the layout. To enable, go to a layout window and click Options > Auto-Generate Planes. For more information, refer to Editing a Plane.
AEL Interfaces
- Following new Net Propagation related AEL APIs have been added:
. db_enable_net_propagation()
. de_is_net_propagation_enabled()
EDA GenAI Capabilities
- In the ADS 2026 Update 1.0 release, generative AI capabilities such as EDA Chat and EDA Copilot(s) are made available. For details, see EDA AI.
- These generative AI capabilities are available for Edge Deployment as add-ons, see EDA GenAI add-ons under Add-On Software / Utilities. For Keysight hosted deployment, contact eda.ai@keysight.com.
- EDA Chat can be accessed from ADS Main window, click Help > Chat. If the EDA Chat add-on is not enabled, you will be redirected to the EDA AI Download page. For EDA Copilot(s), see EDA AI.
EM Simulation
General
- The EM menus and toolbar in the ADS layout window have been enhanced to support all EM view types. Note that the 'EM' icon doesn't change when the view type changes, but it will open the corresponding EM tool. Menu picks and toolbar buttons that are not available for the selected EM view are disabled.
- A new context menu on a substrate allows tagging it as 'EM Substrate'. It will be the default substrate selection when creating a new EM view.
RFPro UI
- 3D elements, e.g., solder balls or bondwires, grouped in an assembly, are now properly passed to the FEM simulator. Previously, they were ignored.
- Parameter names that conflict with unit abbreviations, e.g., "L", "C", etc., are now allowed.
- The bounding box of an encrypted 3D component is rendered in a way that does not prohibit snapping to a non-encrypted part.
- Instances, e.g., padstacks, used in a Smart Mount Pcell will now be processed. Previously, only shapes and vias were considered.
- Enhancements for dealing with the Smart Mount 3D components created by EMPro 2026.
- The File > Save As... menu has been added to allow saving a modified read-only view.
RFPro FEM
- The mesh domain optimization has been refined, which improves the speed of generating an initial mesh.
- The 'Automatic' matrix solver selection will use the 'SDS' solver above 1M unknowns.
- Selected initial mesh generation failures have been addressed.
RFPro Momentum
- Beta feature: new '3D Volume' conductor model selection. The pre-existing '3D' model has been renamed to '3D Surface'. The new model solves the volume current flow inside the conductor, rather than assuming a surface current flow. It improves the simulation accuracy at the expense of simulation time for cases where the current flow doesn't follow the surface. Typically, in the lower frequency range, where the skin effect does not yet dominate. Caution: expect significantly longer simulation times. Performance improvements are under development.
LTD Substrate Editor
- The metal bias specification has been enhanced to support mask coloring.
Broadband Spice Model Generator
- The accuracy at DC of the RFM output has been improved.
Examples
General
Added a new example, "Ku_Band_MMIC_Amp_wrk", to demonstrate circuit simulation and RFPro EM analysis for a Ku-Band MMIC amplifier.
Updated Photonics examples.
HSD
DDR/Memory
- Supports HBM4 in Memory Designer.
- Supports InfiniiMax Probe loading within the Memory Probe in Memory Designer.
- Moves the re-config mask option from Design Exploration to the Setup Probe tap in Memory Designer.
- Supports PAM-n signal mask reconfiguration within the re-config mask option in Memory Designer.
- Supports the DDR4, DDR5 Geardown mode by separating CA, CMD, and CS to clock period ratio setting within Memory Designer Setup in Memory Designer.
- Supports the latest DDR5 speed grade (up to 8800MT/s) in Memory Designer.
- Updates LPDDR5 and DDR5 mask values based on speed grade in Memory Designer.
- Supports HSpice Netlist name parsing within Memory Pre-Layout in Memory Designer.
- Supports CSV file batch simulation within Memory Designer Setup in Memory Designer
SerDes/Chiplet
- Supports UCIe 3.0 in Chiplet PHY Designer.
- Supports new 3D Interconnect Designer component in Chiplet PHY Designer.
- Supports CSV file batch simulation within Chiplet PHY Setup in Chiplet PHY Designer.
- Supports HSpice Netlist name parsing within Chiplet Pre-Layout in Chiplet PHY Designer.
- Supports COM (Channel Operating Margin) 4.8 in System Designer for Ethernet.
- Supports COM (Channel Operating Margin) sweep in System Designer for Ethernet.
- Supports Custom Rule Editor in System Designer for PCIe, USB, and Ethernet.
- Supports updating the host/device/root complex/endpoint/module's number of links, as well as signal type and index, based on channel information in System Designer for PCIe, USB, and Ethernet.
Chiplet 3D Interconnect Designer
- Pre-layout driven 3D interconnect design workflow solution. For more information, see 3D Interconnect Designer Simulation.
- Simulates interconnects with hatched ground planes.
- Supports rectangular and diamond-shaped hatch patterns.
- Supports UCIe standard bump map definitions.
- Supported interconnect types: microbumps, vias, and bus interconnects.
- Supports auto-routing for breakout feeds for via structures.
- Supports organic and silicon substrates.
- Supports component-level and interconnect-level simulations.
General
- Supports multiple file/data loads in S-parameter Toolkit.
EM - PIPro
- The test Bench schematics for PI analyses containing Sink Package Models with a Shunt RC package model will always have an SRC component in parallel with each of these sink components. Current probes are added to measure the package-level and die-level currents separately.
- Added CISPR-32 option to Conducted EMI analysis.
- Near fields no longer need to be saved to disk when computing radiated EMI in a Conducted EMI analysis.
EM - SIPro/PIPro
- Net parametrization: modify and sweep geometries.
Photonic Designer
General
- Photonic Designer is now included with ADS and no longer requires a separate download.
Component library
- New components
. Optical S-parameter simulation block
. LED component
. Behavioural Photodetector component
. LED-SMF coupling component
. User-defined material loss for custom material component
- Improvements
. Enhanced accuracy for user-defined material loss fitting.
. Dedicated menus for Photonic Designer Help and Modesolver functionality.
- Bug fixes:
- Resolved issue with single-model fiber component in envelope simulation.
PDK validator
- PDK Validator config files added in PDK, to be used with the library configuration option for running the PDK validator in ADS.
Licensing
- A valid Photonic Designer license is required to access and use this PDK.
Power Electronics
PE Transformer Designer
- Material Library Integration: Added a comprehensive ferrite material database with 50 materials and automatic parameter population for transformer core modeling.
- Simple Model Support: Implemented mutual inductance-based simple transformer modeling option and enhanced UI for improved design workflow.
Shooting Analysis
- Added support for MOSFET Level 1, 2, and 3 models in shooting analysis.
Broadband SPICE Model Generator
- Improved DC and low-frequency fitting accuracy.
PE Example
- Added an example to demonstrate the PE Transformer Designer feature.
Quantum
General
- Two new design flow examples-3D_Qubit and Finding_SQUID_Extrema-have been added to demonstrate recent enhancements:
. 3D_Qubit showcases 3D qubit modeling using the PEC background feature.
. Finding_SQUID_Extrema illustrates how to analyze multistable SQUIDs using the SQUID Extrema Analysis Tool.
QuantumPro
- QuantumPro can now automatically generate a Results Summary PDF after each simulation run. The report includes key outputs and Descriptions from both the Full EM and Energy Participation analyses - streamlining documentation and improving collaboration for quantum design workflows.
- QuantumPro now supports computation and visualization of Qubit-Qubit Coupling (J) and Rabi frequency (g) within extracted parameters from full EM analysis. Additionally, participation ratios (EPR) are now displayed as outputs from energy participation analysis.
- QuantumPro now enables the extraction of frequency values at each adaptive pass of the eigenmode calculation. This functionality is accessible via Python scripting, allowing users to programmatically retrieve and analyze the convergence behavior of frequencies throughout the simulation process.
- QuantumPro now includes an advanced option in its finite element analysis workflow that allows users to prescribe arbitrarily shaped background materials as a Perfect Electric Conductor (PEC). This enhancement enables accurate modeling of 3D Qubits and supports the integration of packaging environments around qubit circuits-unlocking truly 3D electromagnetic simulation capabilities.
Quantum Circuits
- Beta Release:
The SQUID Extrema Analysis Tool is now available in ADS Quantum Tools. This beta feature enables efficient enumeration of all DC solutions in flux-biased, multistable SQUID circuits-supporting advanced qubit design. Users can analyze multi-junction SQUIDs, sweep external flux to identify extrema, and extract loop currents, potential energies, and effective inductance for simulation-ready parameters.
- Qubit-Qubit Coupling (J) and Rabi Coupling (g) are now available in Quantum Extraction within the ADS Circuit Environment. This enhancement supports more accurate modeling and analysis of quantum interactions in circuit-level simulations.
- We've expanded the qubit library available for Hamiltonian analysis by adding support for ZeroPiZeta and Cos2Phi qubits. This enhancement enables broader modeling capabilities and supports more advanced quantum circuit simulations.
Verification
General
- The DRC/LVS 3rd party links support configuring the following fields in the Options/Settings tabs of the dialog. It is no longer necessary to set the information using environment variables.
. Tool installation directory
. Tool license file
Layout Versus Schematic
- ADS LVS error reporting is improved. Pins and shapes on gnd! that are not physically connected are listed as separate errors. Select each entry in the report to highlight islands of gnd!

Circuit Simulation
General
- Fixed an issue where an error occurred during simulation when the "Use Sweep Plan" option is used without specifying a sweep plan in the Parameter Sweep.
Data Display
General
- Fixed a potential crash in loading data-display file with Python equations.
- Fix a crash where a large enough Data Display file would cause the DDS process to crash.
- Fix the issue where adding or removing a library to a workspace reopened Data Display windows unexpectedly.
- Fixed an issue where font changes were not updated correctly in the Python API.
Design & Tech Management
General
- Fixed the copy/paste of HSD components losing hierarchical data.
- Fix the issue of the EDA chat window not coming up in dark mode when ADS is in dark mode.
- Fix issues with the caranu light/dark setting not being saved properly.
- Remove jupyter_core error that would prepend to all Python console errors.
- Fixed Python automation mode failure for new HOME directories.
- Improved various Python automation failures for functionality only available in the application.
Design Cloud
General
- SNP write failure for the parallelized case.
RF Microwave
- Simulations that consume encrypted models (Spectre models or Verilog-A models) are now supported on Design Cloud.
. For Verilog-A encrypted models, Design Cloud expects the encrypted Verilog-A file with the extension .vax
Design Editing and Layout
General
- Resolved an issue that could lead to the application crashing while flattening a design in-place.
- Fix some 'Alt' hotkeys not working properly.
Design Import/Export
- Fixed a crash occurring when DXF-exporting a design containing instance arrays and a dot character in its name.
- Corrected spelling for the upper-right text alignment XML element name in the ABL schema.
EM Simulation
RFPro
- Fixes a port number collision error when generating a subcircuit schematic view.
Momentum
- The change introduced in ADS 2026 for an edge pin on a thick conductor, to inject the current through the vertical cell connected to the edge rather than the horizontal one, has been reverted. The high-frequency behavior was inaccurate when vias are involved.
HSD
General
- Fixed a bug in the S-Parameter Toolkit where the Differential TDR/TDT matrix does not switch back to the Single-Ended matrix when Single-Ended TDR/TDT is selected.
DDR/Memory
- Fixed a bug in Memory Designer where ADS throws an error when the DDR_Controller or DDR_Memory component name starts with a number.
SerDes
- Fixed a bug in the SerDes Reference Channel component where the PCIe CLB (Compliance Load Board) word was shown under the Board instead of the Add-In Card.
PathWave Advanced Design System (ADS)provides a complete set of simulation technologies, ranging from frequency and time-domain circuit simulation to electromagnetic field simulation. ADS lets you fully characterize and optimize designs. The single, integrated design environment provides the system and circuit simulators, along with schematic capture, layout, and verification capability. ADS simplifies your design flow by eliminating the stops and starts associated with changing design tools in mid-cycle.
PathWave Advanced Design System (ADS)
This playlist comprises video tutorials focusing on ADS, providing valuable insights into various aspects, including front-to-back flow, schematic design, layout design, circuit simulation, EM simulation, and much more!
Keysight Technologies Inc.is the world's leading electronic measurement company, transforming today's measurement experience through innovations in wireless, modular, and software solutions. With its HP and Agilent legacy, Keysight delivers solutions in wireless communications, aerospace and defense and semiconductor markets with world-class platforms, software and consistent measurement science. The company's nearly 10,500 employees serve customers in more than 100 countries.







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